Electronic speckle interferometry

Electronic Speckle Interferometry (ESPI) allows surface deformations to be measured accurate to the nanometer. This rapid and spatially resolved measurement technique has long been in use for measuring minimal deformations which may be produced as the result of component vibrations, thermal loading or also mechanical tensile and shearing stresses.

The method involves illuminating an object with an expanded laser beam. The resulting camera images contain a speckle pattern. Any deformation of the object by a fraction of the wavelength leads to a detectable change in this speckle pattern. This allows the measurement of minute motions and surface deformations due to internal stress. Special computer algorithms compute these deviations at high speed, providing real-time deformation measurement.

The great advantage of speckle interferometry is its accuracy: the measuring method has thus long been in use for measuring minimal deformation. Classic ESPI methods frequently use temporal phase-shift methods. It is always necessary in this case to take a sequence of camera images to register all required information on the current state of deformation. The position and shape of the object to be measured must be absolutely stable during the recording time since otherwise, measurement is not possible. This means that the measurements can be conducted only in thermally and mechanically stable conditions. The total time required for a series of tests to examine the mechanical deformation as the result of thermal loading would be extremely long because of this. Examining deformation as the result of dynamic, thermal or mechanical processes is virtually impossible. The

The system from Fraunhofer IPM conducts measurements 500 times per second – commercial units require a few seconds for a single comparable measurement.

Applications »Electronic Speckle Interferometry«

 

Applications

Deformation measurement

Measuring micro deformations

Publications »Electronic speckle interferometry«

Jahr
Year
Titel/Autor:in
Title/Author
Publikationstyp
Publication Type
2022 Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators
Laskin, Gennadii; Heider, Jonas; Schnetzler, René; Fratz, Markus; Schiller, Annelie; Bertz, Alexander; Laufenberg, Markus; Carl, Daniel
Konferenzbeitrag
Conference Paper
2021 High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components
Laskin, Gennadii; Huai, Haosu; Fratz, Markus; Seyler, Tobias; Beckmann, Tobias; Schiffmacher, Alexander; Bertz, Alexander; Wilde, Jürgen; Carl, Daniel
Konferenzbeitrag
Conference Paper
2021 Evaluating Local Delamination of Power Electronic Devices Through Thermal-Mechanical Analysis
Huai, Haosu; Laskin, Gennadii; Fratz, Markus; Seyler, Tobias; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel; Wilde, Jürgen
Konferenzbeitrag
Conference Paper
2014 High-speed deformation measurement using spatially phase-shifted speckle interferometry
Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel
Konferenzbeitrag
Conference Paper
2013 Verformung von Mikrosystemen bei hohen Temperaturen
Berndt, Michael; Carl, Daniel; Fratz, Markus; Steiert, Matthias; Zeiser, Roderich
Zeitschriftenaufsatz
Journal Article
2013 Optische Verformungsmessungen an Mikrosystemen bei extremen Temperaturdifferenzen
Fratz, Markus; Carl, Daniel; Zeiser, Roderich; Berndt, Michael
Zeitschriftenaufsatz
Journal Article
2013 Verformungsmessung von Mikrosystemen bei hohen Temperaturen mit ESPI, DIC und Holographie
Zeiser, Roderich; Steiert, Matthias; Berndt, Michael; Wilde, Jürgen; Beckmann, Tobias; Fratz, Markus
Konferenzbeitrag
Conference Paper
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