Fraunhofer Institute for Physical Measurement Techniques IPM
As the performance and packing density of electronic components increase, the waste heat generated in a confined space also rises dramatically. This leads to dangerously high temperatures and thus increases the risk of device and system failure. Around 55 percent of electronic component failures today can be attributed to increased temperatures. These figures make it clear that tailored cooling concepts are becoming increasingly important to prevent thermal overloads. In addition, many systems, including battery systems, can nowadays only be operated within a defined temperature range
Heat dissipation and temperature control concepts for small and medium loads
Fraunhofer IPM offers services for innovative thermal management. The focus is on cooling and temperature control solutions for small and medium thermal loads. We use cooling technologies based on Peltier elements or highly efficient heat pipes, for example, which we develop according to our customers’ individual specifications.
Our portfolio is complemented by thermal simulations, structural and thermal characterization of materials, components and systems, thermography, and thermal failure analysis. In addition, we are conducting research into heat pipe-based thermal switches for the targeted regulation of heat flows.